Ion Implanter and Datatrak Software Operations

1. PURPOSE/SCOPE
1.1. Purpose: The purpose of this specification is to instruct operators in the wafer implant procedure.
1.2. Scope: This spec applies to all implant operations performed with the Nova 6200-1 and 6200-2 and Datatrak (Dtrak) at CTI Fab 2.

2. RESPONSIBILITIES
2.1. Ion Implant Engineering is responsible for defining the process.
2.2. Ion Implant operators are responsible for performing the assigned tasks.
2.3. Ion Implant operators are responsible for keeping all appropriate records.

3. REFERENCED DOCUMENTS
3.1. Spec G08 - Production Dispatch and Data Entry
3.2. Spec G37 - Tencor 6200 Operation
3.3. Spec I03 - Therma-Probe Operation
3.4. CSJ Spec 09-07001 - Eaton 6200 Preventive Maintenance (common spec)
3.5. Spec I07 - Implant Shift Responsibilities
3.6. Spec D25 - HTC 4000 Box & Boat Washer
3.7. Spec Q14 - Procedure for Storage and Retrieval of Site Records
3.8. Spec G21 - KLA 2131 Operations

4. MATERIALS
4.1. 15% arsine/85% hydrogen dopant gas
4.2. 15% phosphine/85% hydrogen dopant gas
4.3. 100% non-enriched boron triflouride dopant gas
4.4. 100% non-enriched phosphine SDS dopant gas
4.5. 100% non-enriched arsine SDS dopant gas
4.6. lint-free wipes
4.7. isopropyl alcohol (IPA)
4.8. blue Polypro cassettes (boats)
4.9. brown Polypro cassettes
4.10. a yellow Polypro cassette
4.11. white Teflon cassettes

5. EQUIPMENT
5.1. Nova 6200 Medium Current Ion Implanter
5.2. Datatrak (Dtrak) Implant Control System
5.3. Therma Probe Implant monitoring system
5.4. Tencor 6200 Surface Scan particle computer

6. SAFETY
6.1. Ion Implanters use toxic gases, very high voltage and can produce radiation if not properly shielded. Only qualified personnel will repair or maintain the 6200 Ion Implanter.
6.2. All outer doors must be closed before production wafers are processed on the 6200. The personal safety LED must be green.
6.3. Only maintenance technicians may replace the toxic gas cylinders on the 6200.
6.4. A production supervisor must be notified before Maintenance replaces the toxic gas cylinders on the 6200.
6.5. If the toxic gas detector alarms, evacuate the area immediately and contact your supervisor.
6.6. A radiation monitor will be placed on the high voltage terminal and monitored by Maintenance.
6.7. When the 6200 is involved in an emergency, push the EMO button (large red button) to turn the machine off.
Click here for a review of safety practices.

7. CRITICAL REQUIREMENTS
7.1. Any time Maintenance has repaired an implanter power supply or adjusted its amplifier gain, a full high voltage calibration must be done by Maintenance and must pass the limits set in the SPC logbook “6200 Energy Cal”.
7.2. If there is a machine or computer error that prevents the normal processing of wafers, put the 6200 down to maintenance on the Ingres system. The implanter must remain down until Engineering or Maintenance repairs and verifies correct implanter operation. Process Engineering must qualify the 6200 for production after all verification procedures or repairs that may affect dose uniformity or quality.
7.3. When running a Runcard Status Change (RSC), contact an engineer to oversee all RSC processing and to download all new recipes specified on the RSC.
7.4. Whenever a power glitch or power outage occurs, Production must not resume processing until an implant maintenance technician has verified the implanter has properly recovered from the loss of power.
7.5. The Dtrak controller displays the readout for two ion gauges. The readout is located near the bottom on the Dtrak monitor screen. The pressure must be less than 8.0 on the -7 scale, if it is not, contact Maintenance (for example the readout may display 7.9E-7 but not 8.0E-7).

8. OPERATING PROCEDURES AND RESPONSIBILITIES
8.1. MACHINE CONFIGURATION
8.1.1. The 6200 is tuned and controlled by the Digital Terminal Controller and the Dtrak control computer. The Dtrak computer is controlled by the keyboard on the implanter. The Digital Controller is controlled by the keypad represented in Figure I below:


FIL ARC MAG 1 2 3 CLR ENTER
APER EXTR GAS 4 5 6 DISP STAT
OVEN FILT REG 7 8 9 ON OFF
ENER TEST DVM . 0 X PAUSE SEL

Figure 1 The Digital Controller Keypad
The Digital Controller keypad functions are described below:
FIL Sets filament current to the desired level (0-70 Amps)
ARC Sets arc voltage to the desired level (0-70 Volts)
MAG Sets the analyzer magnet to the desired AMU (0-125 AMU)
APER Sets slits aperture opening (0-100%). Not used
EXTR Set extraction voltage to 20 keV.
GAS Selects gas bottle and valve position (%)
OVEN Not used
FILT Not used (do not confuse with FIL)
REG Regulates arc current as a function of filament current
ENER Displays implant energy and acceleration current
TEST Used to re-boot the controller
DVM Volt meter for maintenance use
CLR Clears the value in the main display
ENTER Enters a value or command into the controller
DISP Not used
STAT Not used
ON Not used
OFF Not used
PAUSE Not used
SEL Selects alternate keypad or display functions. For example when the GAS key is pressed, the first function displayed is gas pressure. Pressing the SEL key will change the function to gas bottle select.

8.2. BEGINNING-OF-SHIFT RESPONSIBILITIES
8.2.1. Verify that all the LED lights except one are green.
8.2.2. Verify that the SCAN SIZE thumbwheels are set at 6.0.
8.2.3. Turn the oscilloscope INTEN (intensity) potentiometer clockwise to increase the display brightness.
8.2.4. Have LPO verify that there are at least five wafers for weekly quals in the TW Test Wafers box. If not, refer to Appendix G.
8.3. DAILY QUALIFICATION
8.3.1. Wipe down the loadlocks and endstations with lint-free wipes and IPA.
Note: The particle monitors must be checked on a daily basis or whenever the process chamber has been opened. Consult Spec I07 to see the schedule and responsible shifts.
Note: If the Tencor 6200 is down, particle monitors are to be run on the KLA (see Spec G21).
8.3.2. Run the particle monitor according to the following instructions (a flowchart version of these instructions is presented in Appendix B):
8.3.2.1. Remove two clean Exsil-grade wafers from the Exsil wafer box.
8.3.2.2. Measure the 0.25um particle counts on the Tencor 6200 according to Spec G37. Record the Sum of All Defects count and BIN 1 particle counts.
8.3.2.2.1. If the Sum of All Defects count is greater than 50, do the following:
1. Put the wafers into the dummy box and take the particle count on two more clean Exsil-grade wafers.
2. If, after the second particle count, the count is still above 50, get a new box of wafers and start the particle counts again. (See the Particle Monitor Flowchart in Appendix B for clarification.)
8.3.2.2.2. If the Sum of ALL Defects is less than 50, transfer the wafers to a Teflon cassette and put the cassette on the input station.
8.3.2.3. Use the MANUAL RECIPE DOWNLOADING in Section 8 to implant the two wafers on the 6200 using any weekly qual recipe.
8.3.2.4. Remeasure the two particle monitor wafers on the Tencor 6200, again taking the Sum of All Defects count and BIN 1 particle counts. (This reading is called the POST Reading.)
8.3.2.5. Enter the PRE and POST readings for the Sum of All Defects and BIN 1 particle counts into the electronic logbook under PM 025/050.
8.3.2.6. If the readings are within the SPC limits, you may now run production wafers. If the readings are not within the SPC limits, a red screen will appear, the machine will go down for failing particles, and you must continue with the steps below.
8.3.2.6.1. Run a cassette of clean dummies and retest using the procedure described in DAILY QUALIFICATION (in this section). If the particle monitor test fails a second time, call Maintenance.
8.3.2.6.2. Enter all readings into the electronic logbook.
8.3.2.6.3. If the readings are within the SPC limits, the machine is up for production.
8.3.2.6.4. If the readings are not within SPC limits, contact Maintenance. After Maintenance releases the machine, repeat this particle monitor test.
Note: SPECIAL INSTRUCTIONS FOR 7C1981OT DEVICES AT BCI: A particle monitor must be performed before every BCI-RAM28DC setup. Use the procedure given in DAILY QUALIFICATION (this section) with the following differences:
1. Use two resist coated (DNS Prog 7) dummy wafers and two resist-coated (DNS Prog 7) particle monitor wafers. Place the dummy wafers in slots 2 and 3 and the particle monitor wafers in slots 4 and 5.
2. Use the recipe BCI-RAM28DC to implant the wafers.
8.4. WEEKLY QUALIFICATION
Note: See Appendix I in this spec for a flowchart of this procedure.
8.4.1. Obtain one test wafer per machine from the "TW Test Wafers” box.
8.4.2. Implant one TW test wafer per medium current implanter using the recipe specified in Table I.
Table IImplant Recipes for Weekly Qualification
Shift Day Purpose Recipe
A Monday Arsenic Qual DPI-P26D
B Wednesday Phosphorous Qual NWI-RAM25DC
C Friday Boron Qual TAI-RAM28DC
D Saturday BF2 Qual FDI-P26D

8.4.3. Measure all the implanted TW test wafers on the Thermawave, using the Twave file TEST, TEST, STANDARD.
8.4.4. After all of the implanters have been qualed, enter the data into the electronic logbook under TWAVE-1 as the specified machine. The percentage difference of Twave numbers across all implanters being tested will be calculated by the Electronic logbook.
8.4.5. If a medium current implanter is down for maintenance, the Thermawave number from the latest qual on that implanter will be entered for it, provided that the implanter is not being restricted.
8.4.6. If the qual goes out of control as indicated by Electronic logbook SPC chart, an implant engineer must be notified.
8.4.7. Finished TW test wafers must be placed in a box by the Thermawave labeled “Used Dosetest Wafers” to be used as dummy wafers.
Note: If the Thermawave is down, Production must run the weekly qualification and send the wafers to CMI or CSJ. You may only run the machine for three days after the wafers are sent out.
Caution: Following a major preventive maintenance (quarterly, semiannual, annual) the weekly qual must be performed and all qual data must pass before releasing the tool to production.
8.5. WEEKLY L28 DOSE QUAL
Every Monday, a qual must be run on the 6200s for L28. The wafers will be read at CTI and CMI. Shift A is responsible for the L28 dose qual.
8.5.1. Obtain one wafer from the "TW Test Wafers" box and one bare silicon (Exsil) wafer for each machine.
8.5.2. Implant one TW test wafer per machine using the P31MONITOR recipe. Implant the Exsil wafer using the B11MONITOR recipe. THE WAFERS MUST BE ROTATED 22° BEFORE IMPLANT (see Appendix H).
8.5.3. Measure the implanted wafers on the Thermawave using the Twave file TEST, TEST, STANDARD.
8.5.4. Record the data in the CTI-Twave logbook.
8.5.5. Send the wafers to CMI for measuring on their Thermawave.
8.5.6. Record the CMI values in the CMI-Twave logbook.
8.6. CHUCK TEST
Caution: The chuck test must be done after any chuck maintenance.
8.6.1. Before processing the “chuck test” wafers, open the center door and note which chuck # is up. Keep track of which wafer gets implanted by chuck 1 and 2. Maintain wafer identity of data entry by chuck # 1 or 2.
8.6.2. Implant two Exsil test wafers using the RAM21S TAI Implant dose.
8.6.3. Use the Twave file: TEST directory, CHUCK subdirectory and implanter (6200-1 or 6200-2).
8.6.4. Read these wafers on the Thermawave and record the readings for the wafers from Chuck 1 and Chuck 2 in the Electronic logbook 6200-1 CHUCK EXSIL or 6200-2 CHUCK EXSIL as appropriate.
8.6.5. If readings fail SPC control, make a note of which chuck failed (#1 or #2). Before measuring any other wafers on the Twave print the map by pressing item #2 “Display results” then press #1 “Contour Map”, then notify your supervisor and engineer that the chuck test has failed.
8.6.6. When finished with the chuck test wafers, place them in the box labeled “6200 Dummies”.
8.7. POST-MONTHLY PM QUALIFICATIONS
Note: See Appendix I in this spec for a flowchart of this procedure.
8.7.1. Cycle 100 clean dummy wafers to check for any handling errors that may occur. The 100 dummies must cycle without any errors, if not call Maintenance.
8.7.2. Perform a particle monitor per DAILY QUALIFICATION in this spec.
8.7.3. Perform a 0° and 7° map implant setup procedure as follows (see Appendix J in this spec for a flowchart):
8.7.3.1. Have Operator set up DISH-P2 Implant. for 0°, and RAM215 TAI for 7°.
8.7.3.2. Run a virgin Exsil-grade silicon wafer on each chuck, for each recipe (4 wafers total).
8.7.3.3. Make sure there is paper in the Twave printer.
8.7.3.4. Select the contour/con/map file.
8.7.3.5. Run all 4 wafers through this recipe to “MAP” wafers.
8.7.3.6. Log all map readings (Average and Standard Deviation) in electronic logbook 6200-1 7 or 6200-2 7. Put tool down to Maintenance if any data is out of control.
8.7.3.7. Verify that a concentric pattern exists and that the pattern conforms to the limits specified (see Figure 2 example map). Contact engineer if map does not conform to specified limits.
8.8. SYSTEM SET-UP AND WAFER PROCESSING
Note: See Appendix A for the flowchart of this process.
8.8.1. Check the status of the 6200 implanter on the downtime system.
8.8.2. Check the Engineering Change Notice (ECN) clipboard located at the document control station. Check for any changes pertaining to the operation that might have occurred since your previous shift.
8.8.3. The operator is responsible for obtaining manufacturing priorities for the day.
8.8.4. Remove a lot and runcard from the Implant Inventory shelf according to manufacturing priorities.
8.8.5. Verify that the lot number matches the runcard, wafer scribes, and lot box numbers; also verify that the wafer count is correct.
8.8.6. Verify that the previous page of the runcard is completed and the step numbers are in sequence.
8.8.7. Ensure the Dtrak Controller on the implanter is displaying the CHITS lot move screen. If it is not displaying the move screen, bring up the move screen per Spec G08.
Note: The following is a description of automated downloading. Use Manual Downloading (below) only when running a particle monitor, conditioning, weekly qual, RSCs, or if Ingres is down. See MANUAL RECIPE DOWNLOADING in Section 8.
8.8.8. At the CHITS move screen, scan lot ID # from runcard and enter your operator initials on the keyboard.
8.8.9. A list of the machines the lot can be processed in and the status of each machine will appear. Select the equipment to process the lot in by placing the cursor on the machine desired and hitting <Tab>.
8.8.10. Slide transfer wafers to a white Teflon cassette. Production wafers in a white Teflon cassette should always be “Non-Implanted” wafers.
Caution: If a wafer is present in slot one, remove the wafer using a vacuum wand and place it in an available empty slot.
8.8.11. Use the flat aligner to align the wafers with the flats down and rotate the wafers 360° to check for chipped wafers. If you find any chipped wafers, contact your supervisor. Your supervisor or the area engineer must disposition the chipped wafer(s) per Spec G08.
8.8.12. Finish scanning the lot into Ingres. Enter the checksum (the 6 numbers of the scribe) to verify the wafers.
8.8.13. Place the cassette of wafers into the input station of the implanter.
8.8.14. After entering the checksum the implanter should automatically bring up the Dtrak Setup screen with the correct recipe, lot number, operator initials and wafer count entered in the appropriate rows.
Note: If Dtrak Setup screen does not appear, contact your LPO to fix the machine. If LPO is unable to fix the machine, put the machine down on the maintenance downtime system.
8.8.15. Select Wafer Count on the Implanter Control panel and select the Implant button on the Dtrak screen.
8.8.16. BEAM TUNING PROCEDURE
Note: At this point the Implant Control screen should be visible. Five buttons will appear at the bottom of the screen. These buttons are explained in Appendix E, Dtrak Screens.
8.8.16.1. Select the Monitor button on the Dtrak screen and use the thumbwheel switches to set the Energy and Dose to the setpoints specified.
Caution: The Dtrak Implant Control and Implant Monitor screen do not display the DOSE value in the same format as the thumbwheel switches. For example, the DOSE value for a recipe is 0.60E14. The Dtrak monitor screen displays it as 6.00E13. The Dose controller MUST be dialed as 0.60E14 or the machine will not get the required beam current for this recipe.
8.8.16.2. Set the Beam Control Auto/Manual switch to Manual and, if the Tune Target light is not on, push the Tune Target button. The LEDs should be green.
Note: If changing species, Press TEST, CLEAR, and ENTER.
8.8.16.3. Set the extraction voltage to 20 keV by pressing EXTR, CLR, 20, ENTER. This sets the desired extraction setpoint to 20 keV.
8.8.16.4. Press SEL, DISP to view the actual extraction voltage.
8.8.16.5. Select the appropriate Gas using the keypad as follows: press GAS, SEL, Enter Bottle Number, and ENTER, then push button associated with Gas bottle selected.
8.8.16.6. Set Gas pressure using the keypad. Adjust the needle valve position as needed. Gas pressure is set by entering the desired Valve position by pressing GAS, (value), ENTER. Slowly increase the needle valve position until the gas pressure begins to increase, waiting thirty seconds between adjustments.
Note: The exact values entered are adjusted gradually as you go along.
8.8.16.7. Set your filament current by pressing FIL, CLR, (value), ENTER.
Note: Filament current requirements will change as the source ages.
8.8.16.8. Set your arc voltage. Arc voltage is set by pressing ARC, CLR, (value), ENTER.
Note: Arc current requirements will change as the source ages.
8.8.16.9. Set Analyzer Magnet Unit (AMU) per specified recipe by pressing MAG, CLR, (AMU value), ENTER.
Note: If a beam is not present, adjust your needle valve position, arc, and filament currents again as needed. If a beam is still not obtained, contact your LPO.
8.8.16.10. Optimize your beam current by increasing or decreasing the filament, or arc voltage, until you acquire the desired beam. After optimizing your beam, focus the beam to get as close as possible to the good beam shown in Figure 2 below.
Caution: Do not implant wafers if the scanned waveform is fuzzy or out of focus.

Figure 2 Focused Ion Implant Screen
8.8.16.11. To focus the beam rotate both focus controls to the minimum position. The LEDs will start blinking.
8.8.16.12. Increase the left control towards maximum until the beam outline appears to flatten.
8.8.16.13. Increase the right focus control until the beam starts to rise and the sides of the beam outline become more vertical. Leave the control at this position.
8.8.16.14. Increase the left focus control until the sides of the beam become more vertical. Continue alternately increasing each control in small steps until the sides of the beam outline appear to be flattening.
8.8.16.15. Move the two joysticks to control scan amplitude and centering according to the following instructions:
The scan merge function is controlled by the right joystick. Move this stick from side to side to merge the two beam outlines onto each other. Adjust until the two beam outlines merge into one outline.
The beam centering function is controlled by the side to side movement on the left joystick. Adjust until the beam is centered in the horizontal axis.
The scan amplitude is adjusted by using both the left and right joysticks. Moving the joysticks up increases scan amplitude (more overscan), moving the joysticks down decreases the scan amplitude (less overscan). Adjust until the overscan is approximately a half inch on each side. The loops inside the beam outline should also be centered on the same axis.
The loops are centered by small up/down adjustments on the scan joysticks. Observe the movement of the loops. Reverse the direction of the adjustment if the loops move farther apart. Re-adjust the overscan to approximately 1/2 inch.
8.8.16.16. Set Auto/Manual switch to AUTO and press the Tune Target button. The Tune Target light should turn off.
8.8.16.17. Select Run Batch on the Dtrak screen or press Run Batch on the Implanter controller to start implanting the lot.
8.8.16.18. Visually verify the tilt when the first product wafer gets loaded on the chuck. Open the endstation door (the center door) to check that the tilt angle matches the angle stated in the recipe.
Note: To retune the implanter during an implant, press the TUNE TARGET button. DO NOT switch the Auto/Manual switch to Manual. Press TUNE TARGET again to resume the Implant.
8.8.16.19. Implanted wafers must be unloaded into a brown cassette. Production wafers in a brown cassette must always be Implanted wafers.
8.8.16.20. Remove the lot from the output station and transfer the wafers to the blue cassette.
8.8.16.21. Use the flat aligner to align the wafers with the flats down and rotate the wafers 360° to check for chipped wafers.
8.8.16.21.1. If you find any chipped wafers, contact your supervisor and have Maintenance check the machine. Your supervisor or the area engineer must disposition the chipped wafer(s) per Spec G08.
8.8.16.21.2. If it is determined that the chip was caused by the implanter, go to RESPONSE TO BROKEN WAFERS in Section 8.
8.8.16.22. Flat align wafers with flat down and transfer blue cassette back to the lot box.
8.8.16.23. Scan the lot out in Ingres.
8.8.16.24. Transfer the lot to the next designated step.
8.9. MANUAL RECIPE DOWNLOADING
Note: Use this procedure only if it is an RSC, qual, or if Ingres is down.
8.9.1. If you are not currently in the Dtrak program, press the “Dtrak” button at the bottom of the CHITS screen.
8.9.2. Select the Implant Setup option from the Implant menu.
8.9.3. Press <Enter> at the recipe line and a list of recipes will appear.
8.9.4. Select the recipe to be run or type in the name.
8.9.5. Press <Enter> <Tab> to get to the operator field.
8.9.6. Fill in the remaining four fields with information from the runcard, using the <Tab> key to move between fields.
8.9.7. When all the information is correct, select Implant.
8.9.8. Tune the beam per instructions in BEAM TUNING PROCEDURE in Section 8.
8.10. RESPONSE TO CHAMBER FAULT
8.10.1. If a Chamber Fault occurs during Implant, immediately contact Maintenance to evaluate the problem. DO NOT press any buttons. DO NOT attempt to correct the error.
Note: A chamber fault is indicated by a beeping alarm.
8.10.2. Write down the accumulated dose value and current wafer number.
8.10.3. Log down the equipment on Ingres and contact Maintenance to address the situation.
A chamber fault may result in three different corrective actions:
· Maintenance is able to continue implant without performing maintenance on the tool (resume processing)
· Maintenance resets end-station with a partial implant (go to Response to Partially Implanted Wafers)
· Maintenance determines that a wafer has broken (go to Response to Broken Wafers)
8.10.4. After Maintenance unloads the wafers from the tool, all implanted wafers should be put into a brown cassette and placed in the box labeled "Implanted Wafers". Non-implanted wafers should be put back into the original lot box. Any partially-implanted wafers should be put into the yellow cassette and placed in the box labeled "Partial Implant".
8.10.5. Response To Partially Implanted Wafers
8.10.5.1. Use the Thermawave to test all wafers in the chamber at the time of the malfunction to determine their implant status.
8.10.5.2. If the Twave is down, the wafers must be sent to CMI. Put the lot on hold pending Twave results for the wafers in question.
8.10.5.3. Measure the wafers from the chamber and record the Twave readings for viewing by the area engineer. Engineering must verify which wafers received the full implant and which may have received a partial. All out-of-spec readings must be dispositioned by the area engineer.
8.10.5.4. To process the remainder of the lot, the lot must be backed up on Ingres by the area supervisor or LPO, and Engineering must implant a make-up dose on all partially implanted wafers.
8.10.5.5. When the lot is re-downloaded, enter the number of wafers still needing an implant in the Dtrak and on the 6200 controller. Refer to MANUAL RECIPE DOWNLOADING in Section 8.
8.10.6. Response To Broken Wafers
8.10.6.1. In the event wafers break in the system, contact Engineering to disposition the wafers.
8.10.6.2. After Maintenance releases the implanter to production, 48 dummies must be run without any errors.
8.10.6.3. If further errors occur, contact Maintenance to address the situation.
8.10.6.4. When the implanter is given back to production, a particle monitor must be run (see Particle Monitor Flowchart, Appendix B).
8.10.7. If any cassettes were contaminated by the broken wafers, clean the cassettes according to Spec D25.
8.11. IMPLANTER SHUTDOWN PROCEDURE
8.11.1. Press TUNE TARGET. Set the BEAM CONTROL switch to manual. The Beam Control light should turn yellow and the Accelerator Ready light should turn red.
8.11.2. Press TEST, CLR, and ENTER.
8.11.3. Set the ENERGY thumbwheel switches to 000.
8.11.4. Contact Maintenance to complete the shutdown of the machine.
WARNING: In an emergency, shut down the implanter by pressing the EMO button. Use this button only in true emergency situations such as a fire or toxic gas leak.
8.12. DATATRAK SHUTDOWN/RESTART PROCEDURE
8.12.1. Enter the Dtrak Window.
8.12.2. Select the “Recipes” option from the menu.
8.12.3. Select the “Exit” option from the submenu.
8.12.4. Press “OK” in the Exit Data Track Window. Select E to exit. This should return you to the “CHITS/Ingres Ion Controller” screen.
8.12.5. From this screen select “Options”.
8.12.6. Select “Quit the Program”. This should return you to the OS/2 Operating System Environment.
8.12.7. Place the mouse arrow in any gray area of the background window.
8.12.8. Press the right hand mouse button.
8.12.9. Place the arrow over “Shutdown” and press the left mouse button. At this point a series of windows will appear asking if you wish to shutdown. Press “OK” or “YES” in all cases. Continue this until the window appears stating “Shutdown has completed...”.
8.12.10. Press <Ctrl><Alt>and<Del> at the same time.
8.12.11. The system should reboot to its normal operating state following this procedure. If it does not work properly after this procedure contact your LPO or area engineer to reset the controller.

9. QUALITY REQUIREMENTS
9.1. All non-conforming materials will be dispositioned per spec G05, 22-00040 and 22-00005.

10. RECORDS
10.1. Records will be kept per Spec Q14.

11. PREVENTIVE MAINTENANCE
11.1. Refer to common Spec 09-07001 for scheduled/non-scheduled preventive maintenance procedures.

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