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1.3 Production Safety Hazards

Objective:
The Operator must be able to identify all major safety hazards in the work area, and must describe how to avoid all safety hazards.

Introduction:
Processing with semiconductor equipment poses safety risks to the
Operator, to the machine itself, and to the product. This chapter will
discuss the most important precautions the Operator must take to ensure
safety.


Contents:
1.3.1 Mechanical Safety Hazards
1.3.2 Thermal Hazards
1.3.3 Electrical Hazards
1.3.4 Gas and Chemical Hazards
1.3.1 Mechanical Safety Hazards

1.3.1 Mechanical Safety Hazards
1. Many semiconductor processing machines have protective covers which
should not be removed without authorization.
2. Pneumatic valves are used in many machines. Mechanical hazards are
posed by the pneumatic valves used for opening and closing doors between
chambers. A closing door may have sufficient force to severely damage
anything in its path.
3. Mechanical gears and servo motors are used to control the robot arm
movements. These motors will cause injury if they are activated when an
individual is in physical contact or close to the robot arm.
4. Loose garments, gloves, and neck bands can be easily caught in moving
parts.
5. Lifting the Plexiglas panel behind the machines poses a safety
hazard. Employees may fall through the floor panel.


1.3.2 Thermal Hazards
1. Machine operation will often require high intensity light and cause
hot surfaces on such places as quartz chambers, lamps, and the wafers
themselves. When heated these surfaces will cause burns.
2. When heated to operating temperatures, the RTA’s lamps and
surrounding quartzware generate infrared radiation which is harmful to
the eyes.


1.3.3 Electrical Hazards
1. Many semiconductor processing machines use high-voltage power that
can cause shock or burns. Most machines use a yellow triangular warning
label to identify the locations of the greatest electrical shock
hazards.
2. Removing protective covers may expose the Operator to electrical
hazards.
3. Most semiconductor processing machines have Emergency Off buttons
(labeled EMO). These buttons will disconnect power from the main
contactor in the Main AC box. Do not hesitate to use these buttons if a
personal or product safety hazard should arise.


1.3.4 Gas and Chemical Hazards
1. Semiconductor processing requires the use of gases and chemicals such
as HF, H2SO4, N2O, and arsine which are health hazards.
2. Inert gases such as nitrogen (N2) and argon (Ar) are used in semiconductor processing.
N2 and Ar are not toxic but will cause suffocation when concentrated in
a small area.


Click for Sample 1: A Production Process
Click for Sample 2: Production Safety Hazards
Click for Sample 3: Alarm Reset Instructions
Click for Sample 4: Software Instructions (long)
Click for Sample 5: Machine/Software Instructions (long)

 

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